Growth behavior of voids randomly distributed at grain boundary on thin metal film with bamboo microstructures under thermal residual stress field and electric field
1 State Key Laboratory for Strength and Vibration of Mechanical Structures, Xi'an Jiaotong University Xi'an, 710049, China
2 School of Electronic and Information Engineering, Xi'an Jiaotong University - Xi'an, 710049, China
Received: 27 May 2015
Accepted: 9 September 2015
Based on the rigid grain hypothesis, an analytic expression is developed to investigate the grain boundary void growth on a thin metal film with bamboo microstructures under thermal residual stress field and electric field. The effect of the microstructure of the thin metal film, thermal residual stress, applied electric field, and diffusivity ratio between the grain boundary and the interface on the growth behavior of the voids and the stress evolution is evaluated. The result shows that the thin metal film with fine grains near the anode end may inhibit void nucleation and growth, which is beneficial for the optimization design of the thin metal film with bamboo microstructures.
PACS: 66.30.Qa – Electromigration / 05.70.-a – Thermodynamics / 68.35.Ja – Surface and interface dynamics and vibrations
© EPLA, 2015