A feasibility study of embedded conductive layer fabricated by ion implantation H. Y. Zhang, X. R. Fan, Q. Y. Meng, Y. Wei, Y. Huang, H. M. He, Y. Wang and W. J. Wu EPL, 138 4 (2022) 47001 Published online: 01 June 2022 DOI: 10.1209/0295-5075/ac6e83