Volume 85, Number 4, February 2009
Article Number 40006
Number of page(s) 6
Section General
Published online 04 March 2009
EPL, 85 (2009) 40006
DOI: 10.1209/0295-5075/85/40006

Fluid heat transfer characteristics with viscous heating in the slip flow region

Tiantian Zhang1, 2, Li Jia1, Zhicheng Wang3, 4, Chengwen Li1 and Yogesh Jaluria2

1   School of Mechanical and Electronic Control Engineering, Beijing Jiaotong University - Beijing, 100044, China
2   Department of Mechanical and Aerospace Engineering, Rutgers University - Piscataway, NJ, 08854, USA
3   Graduate University of the Chinese Academy of Sciences - Beijing, 100049, China
4   Institute of Engineering Thermophysics, Chinese Academy of Sciences - Beijing, 100080, China

received 29 November 2008; accepted in final form 2 February 2009; published February 2009
published online 4 March 2009

An analytical solution for steady laminar fully developed convective heat transfer between parallel plates in the slip flow region with non-symmetric constant-heat-flux boundary condition, which can cover most practical microflow boundary conditions, is given, based on the superposition principle. The velocity slip and temperature jump at the wall, which are the characteristics in the slip flow region, and the viscous heating effect are considered in the calculation. The solution method is verified for the cases of constant-heat-flux boundary condition and for one wall taken as adiabatic and the other wall with constant-heat-flux boundary condition, where microscale effects are neglected (Knudsen number Kn = 0, Brinkman number Br = 0). The effects of the Brinkman number, non-symmetric heat flux and Knudsen number on the Nusselt number, which expresses the heat transfer performance are analyzed systematically. It is found that the closer the heat flux at the two walls is, namely the closer the symmetric ratio q* to 1, the higher the observed heat transfer performance for the microchannels.

05.70.-a - Thermodynamics.
47.55.Ca - Gas/liquid flows.
47.61.Fg - Flows in micro-electromechanical systems (MEMS) and nano-electromechanical systems (NEMS).

© EPLA 2009