Volume 45, Number 6, March II 1999
|Page(s)||680 - 685|
|Section||Condensed matter: structure, mechanical and thermal properties|
|Published online||01 September 2002|
Simulations of an electromigration-induced edge instability in single-crystal metal lines
Department of Physics, Colorado State University - Fort Collins, CO 80523 USA
2 Laboratoire MATOP, Case 151, Faculté des Sciences et Techniques de Saint-Jerôme 13397 Marseille Cedex 20, France
Accepted: 7 January 1999
We study the time evolution of a perturbation to the edge of an otherwise straight, current-carrying, single-crystal metal line. If the applied current exceeds a critical value, the perturbation grows to become a slit-shaped void that spans the wire, and that leads to electrical failure. The slits in our simulations are remarkably similar to those observed in experiments, and in some respects resemble viscous fingers in a Hele-Shaw cell.
PACS: 66.30.Qa – Electromigration / 68.35.Ja – Surface and interface dynamics and vibrations / 05.70.Ln – Nonequilibrium and irreversible thermodynamics
© EDP Sciences, 1999
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