Low-temperature epitaxy and transient diffusion mechanisms on Cu(100)
Physics Department 2, Fudan University, Shanghai
2 CCAST (World Laboratory), P.O. Box 8730, Beijing 10080, China
Corresponding author: firstname.lastname@example.org
Accepted: 3 October 1997
The transient diffusion processes in low-temperature epitaxial growth for the first time have been classified and studied by using molecular-dynamics simulations with a hybrid tight-binding–like potential and taking Cu on Cu(100) surface as an example. The observed diffraction-intensity oscillations show that a quasi–layer-by-layer growth may take place for temperatures as low as 100 K. Furthermore, it has been found that the impact cascade diffusion mechanism plays a noticeable role in promoting atomic mobility and improving the smoothness of thin-film growth in the initial stage.
PACS: 81.15.Hi – Molecular, atomic, ion, and chemical beam epitaxy / 81.15.Jj – Ion and electron beam-assisted deposition; ion plating
© EDP Sciences, 1997