Europhys. Lett, 44 (5), pp. 627-633 (1998)
Low-temperature deposition
of cubic boron
nitride thin films
A. Bonizzi 1, R. Checchetto 2, A. Miotello 2 and P. M. Ossi 3
1 Dipartimento di Ingegneria Nucleare, Politecnico di Milano - I-20133 Milano,
Italy
2 Istituto Nazionale per la Fisica della Materia (INFM) and Dipartimento
di Fisica
Università di Trento - I-38050 Povo (TN) Italy
3 Istituto Nazionale per la Fisica della Materia (INFM) and
Dipartimento
di Ingegneria Nucleare, Politecnico di Milano - I-20133 Milano, Italy
(received 21 July 1998; accepted in final form 15 October 1998)
PACS. 64.70Kb - Solid-solid transitions.
PACS. 68.55Jk - Structure and morphology; thickness.
PACS. 81.15Cd - Deposition by sputtering.
Abstract:
BN thin films have been deposited on (100)-oriented Si wafers by radio
frequency (RF) magnetron sputtering using r.f. target power in the
range and substrate bias voltage in the
range, while maintaining
a low substrate temperature (
). Film characterization has been performed
by using Fourier Transform Infrared Spectroscopy (FTIR), Micro-Raman Spectroscopy,
X-ray Diffraction (XRD) and nanoindentation measurements. With appropriate
choice of the bias voltage BN films with predominant cubic phase (90 at. %) can be obtained. The deposited
layers are nearly stoichiometric (the B/N atomic composition ratio is
) and present a considerable
nanohardness value (
); structural analysis shows grain size in the nanometric range,
thus giving rise to strong phonon confinement effects.
***


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