Issue
EPL
Volume 77, Number 4, February 2007
Article Number 45002
Number of page(s) 5
Section Physics of Gases, Plasmas and Electric Discharges
DOI http://dx.doi.org/10.1209/0295-5075/77/45002
Published online 02 February 2007
EPL, 77 (2007) 45002
DOI: 10.1209/0295-5075/77/45002

Ion flux characteristics in high-power pulsed magnetron sputtering discharges

J. Vlcek, P. Kudlácek, K. Burcalová and J. Musil

Department of Physics, University of West Bohemia - Univerzitní 22, 30614 Plzen, Czech Republic


received 22 September 2006; accepted in final form 12 December 2006; published February 2007
published online 2 February 2007

Abstract
High-power pulsed dc magnetron discharges for ionized high-rate sputtering of copper films were investigated. The repetition frequency was 1 kHz at a fixed $20{\%}$ duty cycle and argon pressures of 0.5 Pa and 5 Pa. Time evolutions of the discharge characteristics were measured at a target power density in a pulse up to $950\,{\rm W}/{\rm cm}^{2}$. Time-averaged mass spectroscopy was performed at substrate positions. It was shown that copper ions are strongly dominant (up to $92{\%}$) in total ion fluxes onto the substrate. Their energy distributions with a broadened low-energy part at a lower pressure are extended to higher energies (up to 45 eV relative to ground potential for the target-to-substrate distance of 100 mm).

PACS
52.50.Dg - Plasma sources.
52.70.-m - Plasma diagnostic techniques and instrumentation.
52.77.-j - Plasma applications.

© Europhysics Letters Association 2007